Prof. Jai Narayan Tripathi is currently an Associate Professor at Indian Institute of Technology Jodhpur, Rajasthan, India as well as an Adjunct Research Professor at Carleton University, Ottawa, Canada. He was a Visiting Professor with the Department of Electronics and Telecommunications, Politecnico Di Torino, Italy in 2023-2024. In the past, he has worked with STMicroelectronics, India, for almost 7 years. Dr. Tripathi received the Ph.D. degree in Electrical Engineering from Indian Institute of Technology Bombay, Mumbai, India, in 2014. He was a Visiting Scientist with the Politecnico di Torino, Turin, Italy, in 2016 and 2017, where he was also a Visiting Postdoctoral Fellow, in 2016. His current research interests include signal integrity, power integrity, electromagnetic interference/electromagnetic compatibility, metaheuristic optimization, and RF circuits. He has authored or coauthored over 125 research papers in refereed journals, as book chapters and in the proceedings of top international conferences. 

Dr. Tripathi has received a couple of sponsored research grants as well as SIRE Fellowship from Science and Engineering Research Board (SERB), Govt. of India. His papers have won best paper awards in a couple of international conferences. He has received the YITP Research Award by ACRI, Italy in 2016 and 2017. Dr. Tripathi has served as a TPC Member for over 30 international conferences including the premier conferences such as IEEE EPEPS, IEEE SPI, IEEE VLSI Design, IEEE EDAPS, etc. He was an Invited Speaker in IEEE EDAPS 2015, Seoul, South Korea. He has served as a TPC Co-Chair for IEEE EDAPS 2018 and IEEE EDAPS 2024. He has been a Session Chair in several international conferences. He has been serving as a referee for many IEEE journals. Dr. Tripathi was a member of the 'Best Paper Award Committee' of IEEE EDAPS 2020. He has delivered invited talks at various universities and international forums. Dr. Tripathi is currently working as an Associate Editor for IEEE Transactions on Signal and Power Integrity, IEEE Transactions on Components, Packaging and Manufacturing Technology and IEEE Electromagnetic Compatibility Magazine. In the past, he has also served as an Associate Editor for IEEE Open Journal of Circuits and Systems. He is a Senior Member of IEEE.