Packaging Tools
- Semi-Automatic Wire Bonder
- Wafer Dicing Tool
Semi-Automatic Wire Bonder
NAME OF INSTRUMENT: SEMI-AUTOMATIC WIRE BONDER
COMPANY: HYBOND (USA)
MODEL: HYBOND 626
APPLICATIONS: Wire bonding of sensors, and semiconductor devices on a chip for electrical connections. It enables precise placement and bonding of wires, ensuring low resistance, high reliability, and consistent performance.
Specifications
| Parameter | Specification |
|---|---|
| Ultrasonic (U/S) System | PLL self-tuning 62.5 KHz (nominal), ±2.5 KHz |
| U/S Power Range | 0–0.2 W (low), 0–2 W (high) |
| Bond Time Range | 0 ms to 900 ms |
| Bond Force Range | 12 g to 250 g |
| Temperature Control Range | Ambient to 250 °C |
| Bondable Wire Diameters | Ball: 0.7–3.0 mil (18–76 µm); Wedge/Peg: 0.5–3.0 mil (12.7–76 µm) |
| Bondable Ribbon Dimensions | Up to 1 × 20 mil (25.4 × 510 µm) in Wedge or Peg mode |
| Bondable Wire/Ribbon Materials |
Ball: Gold, Platinum Wedge: Gold, Aluminum, Copper, Silver, Platinum |
| Bond Head Movement/Reach | Motorized (servo); switch- or foot-controlled; horizontal reach: 6.5 in (165 mm) |
| Bond Actuation/Bond Height Detect | Sensor at bond surface contact |
| Z Travel / Vertical Bonding Window | 0.750 in (19.0 mm) / 0.740 in (18.7 mm) |
| Table Motion | 4:1 manual manipulator (standard) |
| Input Power Requirements | 90–260 VAC, 50/60 Hz, 10 A max |
| Minimum Bench Space Required | Width: 25 in, Depth: 30 in (63.5 × 76.2 cm) |
| Unit Weight / Shipping Weight | 70 lbs (31.8 kg) / 150 lbs (68.2 kg) |
| Vacuum Requirement | 20 inHg minimum (only needed if using vacuum work stage) |
| Industry Standards | CE |
Wafer Dicing Tool
NAME OF INSTRUMENT: DAD 323 WAFER DICING TOOL
COMPANY: DISCO CORPORATION (JAPAN)
APPLICATIONS: Fully automated precisions saws cut the wafer. The device can be used for processing substrates such as silicon, glass, ceramic, SiC and other structures up to 6 inches in size.
Specifications
| Specification | Unit | Value |
|---|---|---|
| Max. workpiece size | – | Φ6 inch / 150 mm × 150 mm (user-specified specification) |
| X-axis Cutting range | mm | 160 |
| X-axis Cutting speed | mm/s | 0.1 – 800 |
| Y-axis Cutting range | mm | 162 |
| Y-axis Index step | mm | 0.0001 |
| Y-axis Index positioning accuracy | mm | 0.005/160 (Single error), 0.003/5 |
| Z-axis Max. stroke | mm | 32.2 (Φ2 inch blades) |
| Z-axis Moving resolution | mm | 0.00005 |
| Z-axis Repeatability accuracy | mm | 0.001 |
| θ-axis Max. rotating angle | deg | 320 |
| Spindle Output | kW | 2.0 at 40,000 min⁻¹ |
| Spindle Rated torque | N·m | 0.48 |
| Spindle Revolution speed range | min⁻¹ | 3,000 – 40,000 |
| Machine dimensions (W × D × H) | mm | 490 × 870 × 1,600 |
| Machine weight | kg | Approx. 400 |
