Deepak Arora
Deepak Arora
Associate ProfessorAbout :
Dr. Deepak Arora is a solution-driven technologist with deep expertise in structure-process-property relationships, rheology, and capability development for polymers/composites. With significant experience in electronic packaging, he has developed advanced solutions in material, design, and process development. His work spans wafer- and panel-level packaging, including fan-in, fan-out, flip-chip (coreless and thin core), and die-embedding technologies.
Dr. Arora is highly experienced in working with both domestic and international cross-functional teams and partners to push the boundaries of electronic packaging technology.
Current Role
Associate Professor
Indian Institute of Technology Jodhpur (IITJ)
February 2020 - Present
Dr. Arora currently serves as an Associate Professor at IIT Jodhpur in the Department of Chemical Engineering. His research focuses on polymer nanocomposites for applications in electronic packaging and healthcare.
Previous Experience
Research Packaging Engineer
FUJIFILM Electronic Materials, North Kingstown, RI, USA
August 2016 - May 2018
Dr. Arora developed cutting-edge materials for advanced electronic packaging and formulated a polymer dielectric platform that passed reliability tests conducted by an industrial consortium, enhancing his work's impact on the industry.
Process Development Lead
Intel Corporation, Chandler, AZ, USA
October 2011 - May 2016
Dr. Arora led technology development in substrate technology at Intel, enabling high-volume manufacturing. His work saved the company $4 billion and improved its competitive edge. He was instrumental in developing coreless and die-embedding technologies, achieving a 90% yield in technology development. His contributions were recognized through several awards, including nine departmental awards, two divisional awards, one group award, and seven peer-to-peer recognitions.
Education
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MS - PhD in Polymer Science and Engineering
University of Massachusetts Amherst
August 2004 - May 2010
Thesis: Structure-property evolution during polymer crystallization
Advisor: H. Henning Winter -
BTech - MTech in Chemical Engineering
Indian Institute of Technology Madras
July 1999 - June 2004
Honors and Awards
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Department Recognition, Intel Corporation (2014-2015)
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Developed processes that improved inline patterning yield by 10%.
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Enabled the reduction of dielectric cracks preventing reliability failures.
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Implemented a factory capability for 2D ID laser mark on substrates.
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Contributed to significant cost savings through innovation in procurement processes.
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Technology Manufacturing Group Excellence Award, Intel Corporation
2014
Recognized for contributions to substrate technology and core-less technology development. -
Assembly & Test Technology Development Divisional Recognition, Intel Corporation
2013
Awarded for developing a combined process that improved dielectric adhesion with electro-less deposited copper. -
Finalist for the AkzoNobel Student Award
Polymeric Materials: Science and Engineering Program, American Chemical Society
2010 -
GATE Achievement
Secured a place among the top 2.5% of aspirants in the National Graduate Test in Engineering (GATE)
2002 -
Entrance Examination Achievement
Ranked among the top 1% in the entrance examination for Indian Institutes of Technology (IIT)
1999 -
State Merit List Award
Awarded a silver medal for ranking sixth in the State’s merit list out of 200,000 entrants
1996
Invited Talks and Workshops
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Polymer Dielectrics for Semiconductors: Opportunities and Challenges in Advanced Electronic Packaging
Invited talk at the Department of Chemical Engineering, IIT Ropar, 2024 -
Thermal Analysis and Rheology – Hot Stage Microscopy
Invited virtual short course, NATAS, Thermal Analysis Forum of Delaware Valley (TAFDV), 2022 -
Innovation in IC Packaging – India’s Perspective & Approach
Invited panelist at Workshop at Semiconductor Lab (SCL), Mohali, 2022 -
Advances in Electronic Packaging with C4DFED
Invited talk at IIT Mandi, 2022 -
Advances in Electronic Packaging
Invited talk at Semiconductor Laboratory (SCL), Mohali, 2022 -
Thermal Analysis Forum of Delaware Valley
Invited virtual poster evaluation session, 2022 -
International Colloquium on Technology Readiness for High Volume Chip Manufacturing
Invited virtual talk, ICTFab, organized by IIT Mandi, 2021
Research Interests
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Polymer Nanocomposites
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Electronic Packaging Technologies
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Rheology
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Capability Development for Polymers/Composites
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Healthcare Applications of Polymers
